Automatic Solder Solder Solder Definition
Automatic soldering machine solder can be found in the definition of "wetting" is the protagonist in the welding process. The so-called welding is the use of liquid "solder" wetting on the substrate to achieve the effect of bonding. This
phenomenon is like water falling on the solid surface, the difference
is that the welding will be with the temperature drop and solidification
into a contact. When
the solder wetting on the substrate, theoretically, the two will be a
chemical bond between the metal, and the formation of a continuous
bonding, but the actual situation, the substrate will be the erosion of
air and the surrounding environment, and the formation of a Layer oxide film to block the "solder", so that it can not achieve better wetting effect. Its
phenomenon as the water poured on the oil-coated plate, the water can
only be gathered in some places, and can not be evenly distributed on
the plate. If the oxide film on the surface of the substrate can not be removed,
even if barely stained with "solder", the combined strength is still
very weak.
HY-H02 automatic soldering machine: SMT transformers and general
transformer inductors and other high-precision solder electronic parts
and the general use of solder products.
HY-H02
automatic soldering machine: a variety of simulation of human motion
curve, and a 360 degree arbitrarily set flip angle function, welding SMT
and PIN TYPE all kinds of horizontal and other products.
Classification
- Contact
HUIYUE (DongGuan City) Automation Equipment Co., Ltd.
Phone: 0086+15916737121
TEL: 0086+076989870552
FAX: 0086+076986475353
Zip Code: 523900
Email: cr@hyefw.com
Address: 3rd Floor, Building B, No. 6, Dabandi 1 Road, Xiabian, Chang'an Town, Dongguan City, Guangdong Province , China
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Automatic Solder Solder Solder Definition
Hit: Data:2017-02-27 【print】
Automatic soldering machine solder can be found in the definition of "wetting" is the protagonist in the welding process. The so-called welding is the use of liquid "solder" wetting on the substrate to achieve the effect of bonding
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